Gembird TG-G3.0-01 thermal compound 4.5 W/m·K 3 g

This Gembird thermal compound is designed to facilitate heat transfer between the CPU, chipset, or processor and its heatsink. With a thermal conductivity of 4.5 W/m·K, the product helps maintain stable temperatures during hardware operation, ensuring proper thermal management of critical system components.

The material features a stable consistency that prevents separation, flow, or migration once applied. It is non-capacitive and non-electrically conductive, allowing for safe use in electronic environments without the risk of short circuits. The package contains 3 g of gray paste, with packaging dimensions of 120 mm wide, 15 mm high, and 180 mm deep.

• Thermal conductivity of 4.5 W/m·K
• 3 g compound content
• Non-electrically conductive and non-capacitive
• Stability against separation or migration
• Gray color