CoolBox H70 Thermal Compound 3.17 W/m·K 2 g

The CoolBox H70 thermal paste is a heat sink compound intended to optimize temperature transmission between processors, memory, graphics chipsets, and their cooling systems. Its electrically non-conductive composition allows for safe application on various internal components of the equipment, contributing to more efficient thermal management during operation.

This product features a thermal conductivity of 3.17 W/m·K and is supplied in a 2 g container. Its color is gray and its total weight is 0.002 kg. For correct installation, it is recommended to clean the contact surfaces beforehand and apply a thin, uniform layer of the compound before mounting the cooling element.

• Thermal conductivity of 3.17 W/m·K
• Electrically non-conductive composition
• 2 g format
• Gray color
• Low thermal resistance