GENESIS Silicon 900 Thermal Compound Heat Sink Thermal Paste 12.8 W/m·K 2 g

The GENESIS Silicon 900 is a thermal paste designed to improve heat transfer between components. Its 12.8 W/m·K thermal conductivity allows for efficient dissipation, while its 2.8 g/cm³ density ensures proper application on contact surfaces.

The product comes in a 2 g format, sufficient for several applications depending on the surface size. Each package contains one unit, facilitating storage and occasional use for maintenance or assembly tasks of computer equipment.

• 12.8 W/m·K thermal conductivity
• 2.8 g/cm³ density
• Net content of 2 g
• Presented in a 1-piece package