StarTech.com Thermal Paste - Metal Oxide Compound - Resealable Syringes (1.5g) - Thermal Grease Paste for CPU Heatsink

This metal-based compound, containing more than 60% metal oxide, is applied between the processor and the heatsink to improve heat dissipation in integrated chips. Its formulation allows for stable performance at temperatures from -30 °C to 180 °C, with a thermal conductivity of 3.195 W/m-K at 25 °C.

The product comes in a resealable 1.5 g syringe, enough for 4 to 6 applications. The packaging prevents the paste from drying out between uses. The presentation is silver-colored and complies with CE and RoHS certifications.

• Thermal conductivity of 3.195 W/m-K at 25 °C
• Composition with more than 60% metal oxide
• Resealable 1.5 g syringe for 4-6 applications
• Temperature range from -30 °C to 180 °C
• CE and RoHS certifications