GENESIS Silicon 900

GENESIS Silicon 900 is a gray thermal paste designed to improve heat dissipation in PC components. Its formula features a thermal conductivity of 12.8 W/mK and a density of 2.8 g/cm3, allowing it to reach optimal heat transfer values from the first seconds after application, without the need for pre-heating.

The product includes an application kit consisting of a spatula and a wetted cloth to facilitate cleaning and spreading. The paste is electrically non-conductive and offers corrosion resistance. Its format allows for use in desktop computers, laptops, and consoles, maintaining stable performance during work or gaming sessions.

• 12.8 W/mK thermal conductivity
• 2.8 g/cm3 density
• Includes spatula and wetted cloth
• Electrically non-conductive formula
• Corrosion resistant